CEKD Berhad Signs IPO Underwriting Agreement with M&A Securities
CEKD Berhad (CEKD or the Company), a die-cutting solutions provider as well as manufacturer of die-cutting moulds and trader of related consumables, tools and accessories, has on even date signed an underwriting agreement with M&A Securities Sdn Bhd (M&A Securities). This underwriting agreement is a precursor to the upcoming initial public offering (IPO) of the Company on the ACE Market of Bursa Malaysia Securities Berhad ("Bursa Securities") that will take place in September 2021. As reported in the prospectus exposure on the Securities Commission's website, CEKD's IPO entails a proposed publ...